Foamtec UltraSOLV™ ScrubPADS™

Vacuum Chamber Cleaning ScrubPADS for light to heavy duty PM procedures

Supplier:  Foamtec HT451810

Catalog No. 19-042-108

Description

Ideal for wafer processing tools such as LAM 9600 and 2300 Etch chambers, Hitachi Etch chambers, TEL Etch Chambers, Varian Ion Implant Process Areas, Novellus Speed, AMAT TxZ, WxZ, DxZ, SinGEN, PolyGEN, Endura and Producer CVD, PVD tools and Roth and Rau SiNX CVD tools.

• Wide grit selection allows for quick removal of process-induced residue from aluminum, stainless steel, ceramic, glass, quartz and anodized surfaces while minimizing tool wear
• Fiber-free construction reduces particle levels in cleaned tools
• Unique bonding technology minimizes the release of abrasive particles leading to cleaner PM procedures
• Enables the elimination of H₂O₂ from PMs, which greatly reduces recovery times

Specifications

• Product Type: Vacuum Chamber Cleaning Scrub Pad
• For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
• Grit: 180
• Length (English): 4 in.
• Material: Silicone Carbide

• Dimensions (L x W x H): 3 x 4 in.
• For Use With (Equipment): Wafer processing tools
• Includes: Without slit
• Length (Metric): 10.16 cm
• Thickness (English): 0.078 in.